CY7B9911V3.3V RoboClock+™High Speed Low Voltage Programmable SkewClock BufferCypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 951
CY7B9911V3.3V RoboClock+™Document Number: 38-07408 Rev. *D Page 10 of 14Switching Characteristics – 7 OptionOver the Operating Range[2, 11] Parameter
CY7B9911V3.3V RoboClock+™Document Number: 38-07408 Rev. *D Page 11 of 14 AC Timing DiagramstODCVtODCVtREFREFFBQOTHERQINVERTED QREF DIVIDED BY 2REF DI
CY7B9911V3.3V RoboClock+™Document Number: 38-07408 Rev. *D Page 12 of 14Ordering InformationAccuracy (ps) Ordering Code Package TypeOperatingRange500
CY7B9911V3.3V RoboClock+™Document Number: 38-07408 Rev. *D Page 13 of 14Package DiagramFigure 10. 32-Pin Plastic Leaded Chip Carrier J6551-85002-*B[+
Document Number: 38-07408 Rev. *D Revised June 20, 2007 Page 14 of 14PSoC Designer™, Programmable System-on-Chip™, and PSoC Express™ are trademarks a
CY7B9911V3.3V RoboClock+™Document Number: 38-07408 Rev. *D Page 2 of 14Pin ConfigurationPin DefinitionsSignal Name IO DescriptionREF I Reference freq
CY7B9911V3.3V RoboClock+™Document Number: 38-07408 Rev. *D Page 3 of 14Block Diagram DescriptionPhase Frequency Detector and FilterThe Phase Frequenc
CY7B9911V3.3V RoboClock+™Document Number: 38-07408 Rev. *D Page 4 of 14Figure 1 shows the typical outputs with FB connected to a zero skew output.[4]
CY7B9911V3.3V RoboClock+™Document Number: 38-07408 Rev. *D Page 5 of 14Operational Mode DescriptionsFigure 2 shows the LVPSCB configured as a zero sk
CY7B9911V3.3V RoboClock+™Document Number: 38-07408 Rev. *D Page 6 of 14groups, and the PLL aligns the rising edges of REF and FB, youcan create wider
CY7B9911V3.3V RoboClock+™Document Number: 38-07408 Rev. *D Page 7 of 14frequency, while still maintaining the low skew characteristics ofthe clock dr
CY7B9911V3.3V RoboClock+™Document Number: 38-07408 Rev. *D Page 8 of 14Maximum RatingsOperating outside these boundaries may affect the performancean
CY7B9911V3.3V RoboClock+™Document Number: 38-07408 Rev. *D Page 9 of 14CapacitanceTested initially and after any design or process changes that may a
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