Cypress Perform CY7C1370D User Manual

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18-Mbit (512K x 36/1M x 18) Pipelined
SRAM with NoBL™ Architecture
CY7C1370D
CY7C1372D
Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600
Document #: 38-05555 Rev. *F Revised June 28, 2006
Features
Pin-compatible and functionally equivalent to ZBT™
Supports 250-MHz bus operations with zero wait states
Available speed grades are 250, 200 and 167 MHz
Internally self-timed output buffer control to eliminate
the need to use asynchronous OE
Fully registered (inputs and outputs) for pipelined
operation
Byte Write capability
3.3V core power supply (V
DD
)
3.3V/2.5V I/O power supply(V
DDQ
)
Fast clock-to-output times
2.6 ns (for 250-MHz device)
Clock Enable (CEN
) pin to suspend operation
Synchronous self-timed writes
Available in JEDEC-standard lead-free 100-pin TQFP,
lead-free and non-lead-free 119-Ball BGA and 165-Ball
FBGA package
IEEE 1149.1 JTAG-Compatible Boundary Scan
Burst capability—linear or interleaved burst order
“ZZ” Sleep Mode option and Stop Clock option
Functional Description
The CY7C1370D and CY7C1372D are 3.3V, 512K x 36 and
1M x 18 Synchronous pipelined burst SRAMs with No Bus
Latency™ (NoBL™) logic, respectively. They are designed to
support unlimited true back-to-back Read/Write operations
with no wait states. The CY7C1370D and CY7C1372D are
equipped with the advanced (NoBL) logic required to enable
consecutive Read/Write operations with data being trans-
ferred on every clock cycle. This feature dramatically improves
the throughput of data in systems that require frequent
Write/Read transitions. The CY7C1370D and CY7C1372D are
pin compatible and functionally equivalent to ZBT devices.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. All data outputs pass through
output registers controlled by the rising edge of the clock. The
clock input is qualified by the Clock Enable (CEN
) signal,
which when deasserted suspends operation and extends the
previous clock cycle.
Write operations are controlled by the Byte Write Selects
(BW
a
–BW
d
for CY7C1370D and BW
a
–BW
b
for CY7C1372D)
and a Write Enable (WE
) input. All writes are conducted with
on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE
) provide for easy bank
selection and output tri-state control. In order to avoid bus
contention, the output drivers are synchronously tri-stated
during the data portion of a write sequence.
A0, A1, A
C
MODE
BW
a
BW
b
WE
CE1
CE2
CE3
OE
READ LOGIC
DQs
DQP
a
DQP
b
DQP
c
DQP
d
D
A
T
A
S
T
E
E
R
I
N
G
O
U
T
P
U
T
B
U
F
F
E
R
S
MEMORY
ARRAY
E
E
INPUT
REGISTER 0
ADDRESS
REGISTER 0
WRITE ADDRESS
REGISTER 1
WRITE ADDRESS
REGISTER 2
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
BURST
LOGIC
A0'
A1'
D1
D0
Q1
Q0
A0
A1
C
ADV/LD
ADV/LD
E
INPUT
REGISTER 1
S
E
N
S
E
A
M
P
S
E
CLK
C
EN
WRITE
DRIVERS
BW
c
BW
d
ZZ
SLEEP
CONTROL
O
U
T
P
U
T
R
E
G
I
S
T
E
R
S
Logic Block Diagram-CY7C1370D (512K x 36)
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Summary of Contents

Page 1 - CY7C1372D

18-Mbit (512K x 36/1M x 18) PipelinedSRAM with NoBL™ ArchitectureCY7C1370DCY7C1372DCypress Semiconductor Corporation • 198 Champion Court • San Jose,

Page 2

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 10 of 28Partial Write Cycle Description[1, 2, 3, 8]Function (CY7C1370D) WE BWdBWcBWbBWaRead H X

Page 3

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 11 of 28IEEE 1149.1 Serial Boundary Scan (JTAG)The CY7C1370D/CY7C1372D incorporates a serial bou

Page 4

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 12 of 28When the TAP controller is in the Capture-IR state, the twoleast significant bits are lo

Page 5

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 13 of 28in the TAP controller, it will directly control the state of theoutput (Q-bus) pins, whe

Page 6

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 14 of 283.3V TAP AC Test ConditionsInput pulse levels ...

Page 7

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 15 of 28Identification Register DefinitionsInstruction Field CY7C1372D CY7C1370D DescriptionRevi

Page 8

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 16 of 28119-Ball BGA Boundary Scan Order[13, 14]Bit # Ball ID Bit # Ball ID Bit # Ball ID Bit #

Page 9

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 17 of 28165-Ball BGA Boundary Scan Order[13, 15]Bit # Ball ID Bit # Ball ID Bit # Ball ID1N6 31D

Page 10 - [+] Feedback

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 18 of 28Maximum Ratings(Above which the useful life may be impaired. For user guide-lines, not t

Page 11

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 19 of 28Note: 18. Tested initially and after any design or process change that may affect these

Page 12

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 2 of 28Selection Guide250 MHz 200 MHz 167 MHz UnitMaximum Access Time 2.6 3.0 3.4 nsMaximum Oper

Page 13

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 20 of 28Switching Characteristics Over the Operating Range[23, 24]Parameter Description–250 –200

Page 14

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 21 of 28Switching WaveformsRead/Write/Timing[25, 26, 27]Notes: 25. For this waveform ZZ is tied

Page 15

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 22 of 28Notes: 28. The Ignore Clock Edge or Stall cycle (Clock 3) illustrated CEN being used to

Page 16 - 14. Bit# 85 is pre-set HIGH

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 23 of 28Ordering InformationNot all of the speed, package and temperature ranges are available.

Page 17 - 15. Bit# 89 is pre-set HIGH

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 24 of 28250 CY7C1370D-250AXC 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

Page 18

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 25 of 28Package DiagramsNOTE:1. JEDEC STD REF MS-0262. BODY LENGTH DIMENSION DOES NOT INCLUDE MO

Page 19

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 26 of 28Package Diagrams (continued)1.2720.322165437LEABDCHGFKJUPNMTR12.0019.5030° TYP.2.40 MAX.

Page 20

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 27 of 28© Cypress Semiconductor Corporation, 2006. The information contained herein is subject

Page 21

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 28 of 28Document History PageDocument Title: CY7C1372D/CY7C1370D 18-Mbit (512K x 36/1M x 18) Pip

Page 22

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 3 of 28Pin ConfigurationsAAAAA1A0VSSVDDAAAAAAVDDQVSSDQb DQb DQb VSSVDDQDQb DQb VSSNC VDDDQaDQaVD

Page 23

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 4 of 28Pin Configurations (continued)2345671ABCDEFGHJKLMNPRTUDQaVDDQNC/576MNC/1GDQcDQdDQcDQdAA A

Page 24

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 5 of 28Pin Configurations (continued)234 5671ABCDEFGHJKLMNPRTDONC/576MNC/1GDQPcDQcDQPdNCDQdACE1B

Page 25

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 6 of 28Pin DefinitionsPin Name I/O Type Pin DescriptionA0A1AInput-SynchronousAddress Inputs used

Page 26

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 7 of 28IntroductionFunctional OverviewThe CY7C1370D and CY7C1372D are synchronous-pipelinedBurst

Page 27

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 8 of 28Asserting the Write Enable input (WE) with the selected ByteWrite Select (BW) input will

Page 28

CY7C1370DCY7C1372DDocument #: 38-05555 Rev. *F Page 9 of 28Notes: 1. X = “Don't Care”, H = Logic HIGH, L = Logic LOW, CE stands for ALL Chip En

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