Cypress NoBL CY7C1371D User Manual download pdf (Page 20)

CY7C1371D

CY7C1373D

Document #: 38-05556 Rev. *F Page 20 of 29

Capacitance

[18]

Parameter Description Test Conditions

100 TQFP

Package

119 BGA

Package

165 FBGA

Package Unit

Input Capacitance T

= 25°C, f = 1 MHz,

= 3.3V

DDQ

= 2.5V

589pF

CLK

Clock Input Capacitance 5 8 9 pF

Input/Output Capacitance 5 8 9 pF

Thermal Resistance

[18]

Parameter Description Test Conditions

100 TQFP

Package

119 BGA

Package

165 FBGA

Package Unit

Thermal Resistance

(Junction to Ambient)

Test conditions follow standard

test methods and procedures

for measuring thermal

impedance, according to

EIA/JESD51.

28.66 23.8 20.7 °C/W

Thermal Resistance

(Junction to Case)

4.08 6.2 4.0 °C/W

AC Test Loads and Waveforms

OUTPUT

R = 317Ω

R = 351Ω

5pF

INCLUDING

JIG AND

SCOPE

(a)

(b)

OUTPUT

= 50Ω

= 1.5V

3.3V

ALL INPUT PULSES

DDQ

GND

90%

10%

90%

10%

≤ 1ns

(c)

OUTPUT

R = 1667Ω

R = 1538Ω

5pF

INCLUDING

JIG AND

SCOPE

(a)

(b)

OUTPUT

= 50Ω

= 1.25V

2.5V

ALL INPUT PULSES

DDQ

GND

90%

10%

90%

10%

≤ 1ns

(c)

3.3V IO Test Load

2.5V IO Test Load

Note:

18. Tested initially and after any design or process change that may affect these parameters.

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