Cypress NoBL CY7C1371D User Manual download pdf (Page 28)

CY7C1371D

CY7C1373D

Document #: 38-05556 Rev. *F Page 28 of 29

use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to

be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its

products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress

products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. ZBT is a trademark of Integrated Device

Technology, Inc. All product and company names mentioned in this document are the trademarks of their respective holders.

Figure 3. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)

Package Diagrams (continued)

PIN 1 CORNER

15.00±0.10

13.00±0.10

7.00

1.00

Ø0.50 (165X)

Ø0.25MCAB

Ø0.05 M C

0.15(4X)

0.35±0.06

SEATING PLANE

0.53±0.05

0.25 C

0.15 C

PIN 1 CORNER

TOP VIEW

BOTTOM VIEW

2345678910

10.00

14.00

1110986754321

15.00±0.10

13.00±0.10

1.00

5.00

0.36

-0.06

+0.14

1.40 MAX.

SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)

NOTES :

PACKAGE WEIGHT : 0.475g

JEDEC REFERENCE : MO-216 / DESIGN 4.6C

PACKAGE CODE : BB0AC

51-85180-*A

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